PCB Fabrication – Advanced Materials & Finishes
Overview
Advanced applications demand advanced materials and finishes—for high-frequency performance, thermal management, environmental compliance, and durability. Studio Electronics offers PCB Fabrication with advanced materials and finishes, providing the optimal solution for your specific application. As a premier provider of PCB assembly in China, we work with a wide range of substrate materials—FR4, CEM, High-TG, Halogen-Free, Aluminum Base, Copper Base, Ceramic Base, Rogers, and Polyimide—with multiple surface finish options to match your requirements.
Advanced Materials – What We Fabricate
| Material Category |
Specific Materials |
Key Applications |
| Glass Epoxy |
FR4, High-TG FR4, Halogen-Free FR4 |
General-purpose; high-temperature; environmental compliance |
| Composite |
CEM-1, CEM-3 |
Cost-effective; single/double-sided applications |
| Metal Base |
Aluminum Base, Copper Base |
LED lighting; power applications; thermal management |
| Ceramic Base |
Alumina, Aluminum Nitride |
High-frequency; high-power; thermal management |
| High-Frequency |
Rogers (RO4000, RO3000 series) |
RF/microwave; high-frequency; consistent DK |
| Flexible |
Polyimide (PI), Polyester (PET) |
Wearables; medical devices; dynamic flex |
| Specialty |
Resin base, PTFE |
Specialized applications |
Surface Finish Options – Advanced Protection
| Finish |
Properties |
Best For |
| ENIG |
Ni 3-5μm / Au 0.05-0.1μm |
Fine-pitch SMT; long shelf life; excellent solderability |
| HASL |
1-25μm |
Through-hole components; cost-effective; good solderability |
| OSP |
0.2-0.5μm |
Cost-effective; flat surface; fine-pitch SMT |
| Immersion Silver |
0.1-0.3μm |
High-frequency; flat surface; excellent solderability |
| Immersion Tin |
0.8-1.2μm |
Flat surface; press-fit connections; good solderability |
| Gold Plating |
0.8-1.5μm |
Edge connectors; wire bonding; excellent durability |
| ENEPIG |
Ni/Pd/Au |
Wire bonding; superior reliability; long shelf life |
| Hard Gold |
0.5-3.0μm |
Edge connectors; high-wear applications |
Advanced Fabrication Capabilities
| Board Type |
Max Layers |
Min Trace/Space |
Min Drill |
Surface Finishes |
| FR4 - Standard |
20 |
3/3 mil |
0.2mm |
All finishes |
| High-TG FR4 |
20 |
3/3 mil |
0.2mm |
All finishes |
| Halogen-Free |
20 |
3/3 mil |
0.2mm |
All finishes |
| Aluminum Base |
10 |
4/4 mil |
0.3mm |
All finishes |
| Ceramic Base |
10 |
4/4 mil |
0.3mm |
All finishes |
| Rogers |
20 |
3/3 mil |
0.2mm |
ENIG, Immersion Silver, Gold |
| Polyimide (FPC) |
10 |
3/3 mil |
0.2mm |
ENIG, OSP, Immersion Silver |
Why Advanced Materials & Finishes Matter
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Performance – Optimize electrical, thermal, and mechanical performance
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Reliability – Advanced materials ensure long-term reliability
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Compliance – Halogen-Free and RoHS compliance options
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Application Fit – Match material and finish to your specific application
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Low Volume Support – Low volume PCB assembly with advanced materials
Studio delivers PCB Fabrication with advanced materials and finishes—the right solution for your application.
